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Copper pyrophosphate hydrate

Molecular Structure:
MDL:
MFCD00150225
Molecular Formula:
Cu2P2O7·xH2O
Molecular Weight:
301.04(anhydrousbasis)
Alias:
Product order:
Name Specifications Packing Price Delivery
Copper pyrophosphate hydrate CP 500g RMB 132 Consulting service
Copper pyrophosphate hydrate 电镀级,99% 500g RMB 159.5 Consulting service
Character:
粉蓝色结晶粉未,溶于酸,难溶于水,有毒,可与焦磷酸钠形成复盐,对金属离子具有较强络合能力。
Quality Standard:
项目Item                           化学纯
                                    (CP)
含量(Cu2P2O7·3H2O)Assay,%         ≥ 98.0
氯化物(Cl)Chloride,%              ≤ 0.01
钠(Na)Sodium,%                    ≤ 0.01
铁(Fe)Iron,%                      ≤ 0.002


品级Grade                          电镀级  
外观Appearance                    淡兰色粉末
纯度Purity                        ≥99.0%
Fe                                ≤0.01%
Pb                                ≤0.005%
SO4                               ≤0.60%  

Storage:
用作电镀添加剂、配制磷酸盐颜料。
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